Located in the NSL cleanroom, PRB 0115/0117
- Three 3” sputtering sources and one 6-pocket e-beam evaporator in the same deposition chamber
- RF and DC sputtering capabilities
- Two process gases: Argon and Oxygen
- Substrate cleaning with RF plasma
- Sample substrate heating up to 1100° C during deposition
- Optimized for sputter deposition of magnetic metals and/or oxides followed by coating with a precious metal (gold, platinum) using e-beam deposition
- Rapid turn-around operation with a load lock
- Aggressive substrate cleaning and sample ion milling with a collimated Kauffman & Robinson KDC-40 ion source installed in the load lock
- Installed in clean room environment
Available sputter targets:
- Aluminum (Al)
- Cobalt (Co)
- Cobalt/Iron (Co/Fe)
- Copper (Cu)
- Copper/Nickel (Cu/Ni)
- Iron (Fe)
- Niobium (Nb)
- Nickel (Ni)
- Nickel/Iron (Ni/Fe)
- Silicon Dioxide (SiO2)
- Tin (Sn)
- Tungsten (W)
Available e-beam materials:
- Aluminum (Al)
- Chromium (Cr)
- Cobalt (Co)
- Germanium (Ge)
- Gold-Germanium (AuGe)
- Gold (Au) - $0.50/nm
- Iron (Fe)
- Magnesium-Oxide (MgO)
- Nickel (Ni)
- Palladium (Pd)
- Permalloy (Py)
- Platinum (Pt) - $0.65/nm
- Silver (Ag)
- Tantalum (Ta)
- Titanium (Ti)
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